By Ho-Ming Tong,Yi-Shao Lai,C.P. Wong
Advanced turn Chip Packaging provides previous, current and destiny advances and developments in components equivalent to substrate expertise, fabric improvement, and meeting strategies. turn chip packaging is now in frequent use in computing, communications, buyer and car electronics, and the call for for turn chip know-how is constant to develop that allows you to meet the necessity for items that supply higher functionality, are smaller, and are environmentally sustainable.
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Advanced Flip Chip Packaging by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong